24V Active Heatsink Enclosure, Dual Fan Aluminum Cooling Case for High-Power Electronics / RF Amplifier Thermal Management

Product Descriptions

Ensure maximum performance and longevity for your high-power electronic components with our 24V active heat sink module. Designed for demanding thermal management applications, this dual-fan aluminum cooling case provides highly efficient forced-air cooling, preventing overheating and thermal throttling in your critical devices.

It features a brushed nickel-plated aluminum alloy body, equipped with 5010 fans, and a grille housing design. Using forced convection, it limits temperature rise of modules to guarantee long-term reliable and stable equipment operation. Suitable for various rf modules and general equipment enclosures requiring active cooling. It can serve as an external matching heat dissipation part or be integrated as a standalone cooling assembly.

Product Features

1. Compact, Highly Integrated Structure:  Small mounting area, ideal for communication site deployment.
2. Ultra-light aviation-grade aluminum housing: Excellent thermal conductivity with optimized thermal design.
3. Push-pull forced convection cooling: Ensures stable CW operation.
4. Grille housing design: Provides ventilation while protecting against foreign objects.
5. Wide applications: High power supply compatibility, suitable for multiple communication scenarios.

Product Specifications

Installation Method

1. Use M2 screws to secure the heat sink to the communication module or other device chassis.
2. Pay attention to fan’s airflow direction, ensuring it aligns with the cooling requirements of the module.
3. Connect the red-black power cable to a specified 24V or 28V DC power supply.
4. Connect the black wire (negative/GND (-)) first, then the red wire (positive (+)).

Notes: If you purchase our communication module, the power cable of the heat sink is pre-connected to the module at the factory. 

Package List

1 x Dual Fan Heat Sink